• Substrates
COMPEX stocks a full line of Alumina, ALN, Quartz and custom ceramic wafers and can supply them to any required thickness.
• Plating
COMPEX offers various Thin Film Deposition options and Gold or Tin Electroplate options. Plating runs as small as one wafer depending on metallization.
• Photolithography
COMPEX offers a full line of Transmission Line and custom Gold circuits. Please contact us for our capabilities.
• Dicing
Dicing of Alumina, ALN, Duroid, Ceramics and various substrate materials.
• Component Processing and Packaging
We provide full plating, dicing, high-speed testing, and automated inspection/packaging services for a variety of components as small as .007" square. Packaging of most Passive components onto film rings. Let our state-of-the-art equipment and 30 years experience work for you.
