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Specifications:
  Chip Capacitor Standards
  Series Resonant Frequency
  Capacitor Substrates and
  Metallizations
  Typical Temperature
  Characteristics
Components
Assembly & Packaging
Contract Services
Sales Representatives
Tradeshows
Contact Us
Contract Services

• Substrates
COMPEX stocks a full line of Alumina, ALN, Quartz and custom ceramic wafers and can supply them to any required thickness.

• Plating
COMPEX offers various Thin Film Deposition options and Gold or Tin Electroplate options. Plating runs as small as one wafer depending on metallization.

• Photolithography
COMPEX offers a full line of Transmission Line and custom Gold circuits. Please contact us for our capabilities.

• Dicing
Dicing of Alumina, ALN, Duroid, and various substrate materials.

• Component Processing
We provide full plating, dicing, high-speed testing, and automated inspection/packaging services for a variety of components as small as .007" square. Let our state-of-the-art equipment and 30 years experience work for you.



Please contact us for all of your processing needs.




Advanced Multi-Panel Dicing Services



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 Home Page | Chip Capacitor Standards | Series Resonant Frequency | Capacitor Substrates & Metallizations | Typical Temperature Characteristics | Components | CSA SERIES: Edge-to-Edge Chip Capacitors | CSM SERIES: Dual-Pad Chip Capacitors | CRO/CRM SERIES: Row Capacitors | CSX SERIES: Multiple-Value Custom Capacitors | CAD SERIES: Step-Adjustable Binary Array Capacitors | SBMT SERIES: Submounts | MST SERIES: Alumina Mounting Shorts | RPS: Rapid Prototyping System | Assembly & Packaging | Contract Services | Sales Representatives | Tradeshows | Contact Us