COMPEX offers an extensive variety of substrates in both Class I and Class II categories with dielectric constants ranging from 3.8 to 25,000 and beyond. These are the same substrates used to fabricate our components. Other dielectric materials are available; please consult our factory.

CLASS I Dielectric Materials: This class of dielectrics consists of material exhibiting very low losses, extremely low or closely controlled temperature coefficients, negligible voltage and frequency coefficients, negligible aging effects, and high insulation and dielectric breakdown.



CLASS II Dielectric Materials: This class of material is characterized by high dielectric constants, increased losses and higher temperature coefficients. These properties are inherent with this class of material but the high dielectric constants permit the use of smaller size to achieve low series inductance and meet dimensional requirements. Capacitors made with these materials are often used for coupling of microstrip line circuits where the small chip size is necessary. Used as bypass capacitors, the small size provides low series inductance and dielectric losses are typically of little concern.

Tin (T): This economical metallization consists of 150 microinches of tin over non-magnetic leach-resistant nickel which is ideal for virtually every type of solder and soldering technique including reflow.

Gold (G): This metallization consists of a minimum of 70 microinches of gold over non-magnetic leach-resistant nickel or platinum which is ideal for all wirebonding methodologies. Please consult our factory for optimum metallization options for solder applications.